| Clock Doublers |
- 50714CD : 50 GHz Clock Doubler (–3.3 V Supply)
- 50715CD : 50 GHz Clock Doubler (+3.3 V Supply)
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| Differential Encoders, NRZ-to-RZ Converters, and Retimers |
- Outstanding Performance : With fast rise and fall times and exceptionally low jitter, Inphi's high-speed devices execute critical logic and control functions to deliver unprecendented levels of performance for a variety of communications systems.
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Low Power Consumption : Inphi's circuits enable sophisticated system design with minimal power dissipation. These products consume up to 50% less power than competitive offerings and are available in both positive and negative supply versions.
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High Level of Integration : Many of Inphi's high-speed circuits combine previously discrete functions onto a single chip, thereby enabling telecommunications equipment manufacturers to reduce power consumption, component count, and overall system cost.
- Multiple Packaging Options : Inphi's logic components are available in both die and packaged format for maximum design flexibility as well as on an evaluation board for testing purposes
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| Dividers |
- 50718DV :50 Gbps Divide-by-2 and -4 (–3.3 V Supply)
- 50719DV : 50 Gbps Divide-by-2 and -4 (+3.3 V Supply)
- 50728DV :50 GHz Divide-by-8 (–3.3 V Supply)
- 50729DV : 50 GHz Divide-by-8 (+3.3 V Supply)
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| Drivers & Amplifiers |
- MSA Compliant Parts : Inphi's 10 Gbps drivers meet SONET, XFP, and XENPAK specifications, which eliminates the need for external components to modify the MSA power supplies.
- Fast Rise and Fall Times : Inphi's modulator drivers demonstrate excellent eye quality at both 10 and 40 Gbps, resulting in a lower bit error rate which in turn extends transmission reach.
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Low Jitter : Inphi drivers exhibit extremely low added and rms jitter to produce very clean electrical and optical eye patterns, thereby providing increased system margin.
- Small Form Factor : Inphi drivers are available in both die and surface mount packages to minimize board area and maximize electrical performance.
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| GHz Logic: DFFs, TFFs, Fanouts, XORs, Dividers, Doublers, Mux, Demux |
Inphi offers a variety of high-speed logic gates at data rates/frequencies from DC to 50 Gbps/GHz.
Designed to improve system performance while consuming up to 50% less power than competitive products, these devices find widespread application in broadband instrumentation and automated test equipment.
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| Latched Comparators |
- 1385DX : 12.5 Gbps 1:8 Demultiplexer w/ Latched Comparator Input (+3.3 V Supply) - NEW!
- 13606CP : 13 GHz Latched Comparator (-3.3 V Supply)
- 13607CP : 13 GHz Latched Comparator (+3.3 V Supply)
- 25706CP : 25 GHz Latched Comparator (-3.3 V Supply)
- 25707CP :25 GHz Latched Comparator (+3.3 V Supply)
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| Linear Differential Amplifiers |
- 1012VA : DC to 10 GHz Differential Variable Gain Amplifier
- 1010DA : DC to 9 GHz Differential Amplifier
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| Mux/Demux |
- 1385DX 12.5 Gbps 1:8 Demultiplexer with Latched Comparator Input - NEW!
- 2080MX 20 Gbps 4:1 Multiplexer
- 5080MX 50 Gbps 4:1 Mux
- 5081DX 50 Gbps 1:4 Demux
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| Transimpedance Amplifiers 4336TA |
43 Gbps Transimpedance Amplifier With 3.5 KΩ Differential Gain
- High Transimpedance Gain : Inphi's TIAs deliver the highest gain in their class. For SFP+ module applications, Inphi's 10G TIAs eliminate the need for a stand-alone post-amplifier, enabling receiver module manufacturers to reduce bill of materials and manufacturing costs.
- High Receiver Sensitivity : Inphi's TIAs exhibit the highest receiver sensitivity and stressed receiver sensitivity, enabling receiver module manufacturers with high design margins for both SONET and Ethernet applications.
- High Input Overload : Inphi's TIAs offer excellent optical input overload for 10G-BASE-LR/ER, 10G-BASE-LRM, and 10GBASE-SR, as well as 40G VSR applications.
- Low Power Consumption : With power dissipation as low as 100 milliwatts, Inphi's 10G TIAs provide unsurpassed performance and flexibility for both short-reach and long-reach systems while meeting strict MSA power requirements for SFP+ transceivers.
- Small Die Size/Pad Layout : All Inphi TIAs are available in die form (980 µm x 980 µm). Moreover, pad layouts for the 10.7 and 12.5 Gbps devices are optimized for TO can assemblies to enable small form factor designs that comply with MSAs for short-reach transponders.
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RF& MW 
